Our facilities are equipped with state-of-the-art machinery for micro-pitch component placement, automated inspection, and specialized soldering processes, ensuring superior product reliability.
Micro-Pitch SMT Assembly
Automated Optical Inspection
Selective Wave Soldering
High-density component placement with precision down to 0.4mm pitch, supporting complex BGA and QFN packages for demanding applications.
Integrated AOI systems detect solder joint defects, missing components, and polarity errors at high speed, ensuring zero-defect output.
Targeted soldering for through-hole components, minimizing thermal stress on sensitive parts and ensuring robust mechanical connections.
Multi-Stage Quality Assurance
Pre-Production Analysis
In-Process Verification
Post-Assembly Validation
Detailed DFM/DFA reviews and material inspection ensure design integrity and component quality before line integration.
Continuous monitoring of SMT parameters, automated optical inspection, and X-ray analysis for real-time defect detection.
Functional testing, thermal cycling, and environmental stress screening confirm long-term reliability and performance under load.
Performance You Can Trust
99.8%
First-Pass Yield
1.2M+
Placements per Hour
IPC Class 2/3
Compliance
Connect with our engineering and manufacturing directors to discuss your project requirements and scale your production.